It utilizes the highly advanced HKMG technology that has been traditionally used in logic semiconductors.
TSV was first utilized in DRAM in 2014 when Samsung introduced server modules with capacities up to 256GB.
By expanding its use in DDR5, Samsung is further solidifying its leadership in next-generation DRAM technology.
Currently, Samsung is sampling different variations of its DDR5 memory product family to customers for verification.
source: www.techworm.net
