This will actually allow faster responsiveness for high-end computing tasks including parallel computing, graphics rendering and machine learning.
It also satisfies the need for high performance, energy efficiency and reliability, the company said.
These are then vertically interconnected by TSV holes and microbumps, explained Samsung.
Samsungs new DRAM package features 256GBps of bandwidth, which is double that of an HBM1 DRAM package.
Later this year, Samsung plans to follow up with an 8GB HBM2 DRAM package.
source: www.techworm.net
